电子元器件 21-0147C PDF资料

• 型号： 21-0147C

  生产厂家：
  MAXIM[Maxim Integrated Products]

  耐温：
  

  功能描述：
  PACKAGE OUTLINE, UDFN, 0.8mm

  PDF文件大小： Kb PDF页数： Page

  买 21-0147C

具体资料功能参数数据：

Datasheet下载：
21-0147C PDF

其它相似电子元器件型号资料

• 21-0102 Dallas Semiconductor
  PACKAGE OUTLINE, 12,16L 3x3x0.90
• 21-0109B Maxim Integrated Products
  PACKAGE OUTLINE, uMAX, EXPOSED
• 21-0110 DALLAS[Dallas Semiconductor]
  PACKAGE OUTLINE, TQFP, 5x5x1.0mm
• 21-0114 MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE)
• 21-0114B MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE)
• 21-0117G Dallas Semiconducotr
  PACKAGE OUTLINE, UCSP
• 21-0125A MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE
• 21-0132A MAXIM Dallas Semiconductor
  21-0132A
• 21-0136F MAXIM Dallas Semiconductor
  PACKAGE OUTLINE 1216L THIN 3x3x0.8mm
• 21-0139A MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE
• 21-0144B MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE
• 21-0146 MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE TQFP, 10x10x1.0
• 21-0146A MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE TQFP, 10x10x1.0
• 21-0147C MAXIM[Maxim Integrated Products]
  PACKAGE OUTLINE, UDFN, 0.8mm
• 21-0159 DALLAS[Dallas Semiconductor]
  21-0159

English Chinese Spanish Arabic Portuguese Russian Japanese German Korean French Italian

Norsk Svenska Български Polski Dansk Suomi Nederlands Česky Hrvatski Română Ελληνική हिन्दी Philippine latviešu lietuvių српски Slovenski slovenskom українська עברית Indonesia Việt Nam