电子元器件 BSM50GB170DN2 PDF资料
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型号: BSM50GB170DN2
生产厂家:
Siemens Semiconductor Group耐温:
功能描述:
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)PDF文件大小: Kb PDF页数: Page
具体资料功能参数数据:
Datasheet下载:
BSM50GB170DN2 PDF
其它相似电子元器件型号资料
- BSM50GB170DN2 Siemens Semiconductor Group
IGBT Power Module (Half-bridge Including fast free-wheeling diodes Package with insulated metal base plate)
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