Tuotetiedot PDF- MR18R162GAF0-CN9 Hakutulokset

• Osa nro: MR18R162GAF0-CN9

  Valmistaja:
  Samsung semiconductor

  Lämpötila:
  

  Kuvaus:
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

  Pdf koko: Kb PDF-sivut: Page

  Ostaa MR18R162GAF0-CN9

DatasheetPDF löytyi 1 PDF-dokumentteja Löytyneitä:

Datasheet Lataa:
MR18R162GAF0-CN9 PDF

Teemat osa n: o

• MR18R162GAF0 Samsung semiconductor
  (MR18R1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
• MR18R162GAF0-CK8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based on 256Mb A-die, 32s banks,16K/32ms Ref, 2.5V
• MR18R162GAF0-CM8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R162GAF0-CN9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R162GAF0-CT9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

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