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N. parte: 210
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CTS CorporationTemperatura:
Descrizione:
AUTO-DIP Switch Automatically Insertable, Wave Solderable, Board Washable DIP SwitchPDF Dimensioni: Kb PDF Pagine: Page
DatasheetPDF trovati 1 documenti PDF che corrispondono ai criteri di ricerca:
Parte n. connessi
- 21-0056-C MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE, SSOP, - 21-0056C MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE, SSOP, - 21-0075 MAXIM[Maxim Integrated Products]
21-0075 - 21-0076B MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE, SC70, - 21-0098B DALLAS[Dallas Semiconductor]
PACKAGE OUTLINE, SC70L - 21-0102 Dallas Semiconductor
PACKAGE OUTLINE, 12,16L 3x3x0.90 - 21-0109B Maxim Integrated Products
PACKAGE OUTLINE, uMAX, EXPOSED - 21-0110 DALLAS[Dallas Semiconductor]
PACKAGE OUTLINE, TQFP, 5x5x1.0mm - 21-0114 MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE) - 21-0114B MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE, LEAD THIN SOT23, PROFILE) - 21-0117G Dallas Semiconducotr
PACKAGE OUTLINE, UCSP - 21-0125A MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE - 21-0132A MAXIM Dallas Semiconductor
21-0132A - 21-0136F MAXIM Dallas Semiconductor
PACKAGE OUTLINE 1216L THIN 3x3x0.8mm - 21-0139A MAXIM[Maxim Integrated Products]
PACKAGE OUTLINE
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