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N. parte: MR18R1622AF0-CK8
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Samsung semiconductorTemperatura:
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(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5VPDF Dimensioni: Kb PDF Pagine: Page
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Parte n. connessi
- MR18R1622AF0 Samsung semiconductor
(MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die - MR18R1622AF0-CK8 Samsung semiconductor
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - MR18R1622AF0-CM8 Samsung semiconductor
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
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