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• N. parte: MR18R16248EG0

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  Samsung semiconductor

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  Timing Parameters

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Parte n. connessi

• MR18R16248EG0 Samsung semiconductor
  Timing Parameters
• MR18R1624AF0 Samsung semiconductor
  (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
• MR18R1624AF0-CK8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF0-CM8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CN9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CT9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624EG0-CK8 Samsung semiconductor
  Timing Parameters
• MR18R1624EG0-CM8 Samsung semiconductor
  Timing Parameters
• MR18R1624EG0-CT9 Samsung semiconductor
  Timing Parameters
• MR18R1624GEG0 Samsung semiconductor
  Timing Parameters

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