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Dalis Nr: MR18R1624AF0-CM8
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Samsung semiconductorTemperatūra:
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(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5VPDF Dydis: Kb PDF Puslapiai: Page
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Susijusios dalis jokiu
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(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - MR18R1624AF0-CM8 Samsung semiconductor
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - MR18R1624AF1-CN9 Samsung semiconductor
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V - MR18R1624AF1-CT9 Samsung semiconductor
(16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
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