Karta katalogowa PDF dla MR18R326GAG0 wyników wyszukiwania

• Część nr: MR18R326GAG0

  Producent:
  SAMSUNG[Samsung semiconductor]

  Temperatura:
  

  Opis:
  (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

  PDF Rozmiar: Kb PDF Strony: Page

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MR18R326GAG0 PDF

Powiązane Część nr

• MR18R326GAG0 SAMSUNG[Samsung semiconductor]
  (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V
• MR18R326GAG0-CM8 SAMSUNG[Samsung semiconductor]
  (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V
• MR18R326GAG0-CT9 SAMSUNG[Samsung semiconductor]
  (32Mx18) 16pcs RIMM Module based 576Mb A-die banks32K/32ms 2.5V

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