Технические характеристики PDF для MR18R1622AF0 результаты поиска

• Electronic component: MR18R1622AF0

  Произв:
  Samsung semiconductor

  Температура:
  

  Описание:
  (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die

  PDF Размер: Kb PDF Страниц: Page

  Покупать MR18R1622AF0

DatasheetPDF найдено 1 PDF документы, соответствующие вашему запросу:

Технические характеристики Загрузить:
MR18R1622AF0 PDF

Похожие части нет

• MR18R16224DF0 Samsung semiconductor
  Timing Parameters
• MR18R16228DF0
  Timing Parameters
• MR18R1622AF0 Samsung semiconductor
  (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
• MR18R1622AF0-CK8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1622AF0-CM8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1622DF0
  Timing Parameters
• MR18R1622GDF0 Samsung semiconductor
  Timing Parameters
• MR18R16248EG0 Samsung semiconductor
  Timing Parameters
• MR18R1624AF0 Samsung semiconductor
  (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
• MR18R1624AF0-CK8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF0-CM8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CN9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CT9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624EG0-CK8 Samsung semiconductor
  Timing Parameters
• MR18R1624EG0-CM8 Samsung semiconductor
  Timing Parameters

English Chinese Spanish Arabic Portuguese Russian Japanese German Korean French Italian

Norsk Svenska Български Polski Dansk Suomi Nederlands Česky Hrvatski Română Ελληνική हिन्दी Philippine latviešu lietuvių српски Slovenski slovenskom українська עברית Indonesia Việt Nam