电子元器件 MR18R1624AF0-CK8 PDF资料

• 型号： MR18R1624AF0-CK8

  生产厂家：
  Samsung semiconductor

  耐温：
  

  功能描述：
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

  PDF文件大小： Kb PDF页数： Page

  买 MR18R1624AF0-CK8

具体资料功能参数数据：

Datasheet下载：
MR18R1624AF0-CK8 PDF

其它相似电子元器件型号资料

• MR18R1624AF0 Samsung semiconductor
  (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
• MR18R1624AF0-CK8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF0-CM8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CN9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CT9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

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