PDF-Datenblatt für  MR18R1624AF0-CK8  Suchergebnisse

• Art-Nr: MR18R1624AF0-CK8

  Hersteller:
  Samsung semiconductor

  Temperatur:
  

  Beschreibung:
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

  PDF Größe: Kb PDF-Seiten: Page

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• MR18R1624AF0 Samsung semiconductor
  (MR1xR1622(4/8/G)AF0) (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die
• MR18R1624AF0-CK8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF0-CM8 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CN9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V
• MR18R1624AF1-CT9 Samsung semiconductor
  (16Mx16)x2(4/8/16)pcs RIMM Module based 256Mb A-die, banks,16K/32ms 2.5V

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